The Cube is Here!
Micron and Samsung Launch Consortium to Break Down the Memory Wall
Joint Effort Intended to Accelerate Hybrid Memory Cube Interface Adoption, Enable Rapid Pace of Technology Advancements and Future Generations of Electronics
BOISE, Idaho and SEOUL, Korea, Oct. 6, 2011 (GLOBE NEWSWIRE) — Samsung Electronics Co., Ltd. and Micron Technology, Inc. (Nasdaq:MU), — world leaders in memory technology — today announced the creation of a consortium for OEMs, enablers and integrators that will collaborate in developing and implementing an open interface specification for an innovative new memory technology called the Hybrid Memory Cube (HMC).
Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with fellow developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to market a broad set of technologies. The consortium will initially define a specification to enable applications ranging from large-scale networking to industrial products and high-performance computing.


















